| 摘要 |
<p>Wafers (12) are gripped by edge holders (14, 16, 18) which have curved, and optionally, Teflon coated grooves (34) with a radius of curvature greater than that of the edge of the wafer being held. This minimizes stress and torque applied to the wafer that might distort its shape and impair the measurement accuracy of wafer parameters.</p> |
