SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURE THEREOF, CIRCUIT BOARD, AND ELECTRONIC DEVICE

摘要

A semiconductor device comprises a semiconductor element (10) with a plurality of electrodes (12), a wiring pattern (20) connected electrically with the electrodes (12), a plurality of insulating layers (41, 42, 43), and a plurality of external terminals (30) connected electrically with the wiring pattern (20). The insulating layers (41, 42, 43) each include a plurality of holes (44, 46, 48), which are communicating with one another to form an opening (40). The external terminals (30) are located in the respective openings (40). The second hole (46) formed in the second insulating layer (42) is larger than the first hole (44) formed in the first insulating layer (41) under the second layer.