| 发明名称 |
LEADLESS SOLDER |
| 摘要 |
A leadless solder, characterized as containing Sn and Zn, and further containing 0.001 to 3.0 wt.% of Ti. The solder is free of hazardous lead and exhibits satisfactory bonding strength to oxide materials such as glass, ceramics and the like.
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| 申请公布号 |
CA2332587(A1) |
申请公布日期 |
2000.09.21 |
| 申请号 |
CA20002332587 |
申请日期 |
2000.03.09 |
| 申请人 |
NIPPON SHEET GLASS CO., LTD. |
发明人 |
NAKAGAKI, SHIGEKI;SUGANUMA, KATSUAKI;DOMI, SHINJIRO;SAKAGUCHI, KOICHI |
| 分类号 |
B23K35/26;B23K35/28;C03C27/10;C04B37/00;C22C13/00;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
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