SENSOR DESIGN AND PROCESS

摘要

An accelerometer (305) for measuring seismic data. The accelerometer (305) includes an integrated vent hole for use during a vacuum sealing process and a balanced metal pattern for reducing cap wafer bowing. The accelerometer (305 ) also includes a top cap press frame recess (405) and a bottom cap press fram e recess (420) for isolating bonding pressures to specified regions of the accelerometer (305). The accelerometer (305) is vacuum-sealed and includes a balanced metal pattern (730) to prevent degradation of the performance of th e accelerometer (305). A dicing process is performed on the accelerometer (305 ) to isolate the electrical leads of the accelerometer (305). The acceleromete r (305) further includes overshock protection bumpers (720) and patterned meta l electrodes to reduce stiction during the operation of the accelerometer (305 ).