LAMINATE FOR MULTI-LAYER PRINTED CIRCUIT

摘要

A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate (12) formed of a first polymeric material. At least one layer of a flash material (14) is applied t o a first side of the film substrate. At least one layer of copper (16) is disposed on the layer of flash material. An adhesive layer (18) formed of a second polymer material has a first surface that is attached to a second sid e of the film substrate.