发明名称 WEB PROCESS INTERCONNECT IN ELECTRONIC ASSEMBLIES
摘要 <p>Apparatuses and methods for forming displays are claimed. One embodiment of the invention relates to depositing a plurality of blocks onto a substrate and is coupled to a flexible layer having interconnect deposited thereon. Another embodiment of the invention relates to forming a display along a length of a flexible layer wherein a slurry containing a plurality of elements with circuit elements thereon washes over the flexible layer and slides into recessed regions or holes found in the flexible layer. Interconnect is then deposited thereon. In another embodiment, interconnect is placed on the flexible layer followed by a slurry containing a plurality of elements.</p>
申请公布号 WO2000055915(A1) 申请公布日期 2000.09.21
申请号 US2000002348 申请日期 2000.01.31
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