| 摘要 |
A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12). |
