Semiconductor device production method, involves fastening protective layer at assembly mounting device with wafer edge removed from protective layer and wafer connected at side opposite to assembly mounting device

摘要

The method involves fastening a protective layer at an assembly mounting device. A wafer edge is removed from the protective layer and the wafer is connected at a side opposite to the assembly mounting device. The protective layer is loosened and the wafer removed The wafer is divided along the wafer edge region by chip isolation. An Independent claim is included for a semiconductor device.