发明名称 Method of manufacturing a mosfet
摘要 A side-wall film of a gate electrode is fabricated as a two-layer structure including an underlying thin silicon nitride film and a relatively thick silicon oxide film. The silicon nitride film covers and protects the edge of the gate oxide film against formation of a gate bird's beak at the edge of the gate oxide film. The side-wall contacts with the silicon substrate substantially at the thick silicon oxide film of the side-wall, which prevents formation of a carrier trap area adjacent to the channel area. The bottom of the side-wall may be a nitride-doped silicon oxide instead.
申请公布号 GB2313476(B) 申请公布日期 2000.09.20
申请号 GB19970010410 申请日期 1997.05.20
申请人 * NEC CORPORATION 发明人 ATSUKI * ONO
分类号 H01L29/78;H01L21/28;H01L21/318;H01L21/336;H01L29/49;(IPC1-7):H01L21/28;H01L29/417 主分类号 H01L29/78
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