Prepreg and laminated board

摘要

A prepreg formed of a resin composition comprising, as essential components, a phenol compound (I) having a structural unit of the formula (1), wherein R<1> is hydrogen or phenol, R<2> is hydrogen or methyl and n is an integer of 0 to 10, an epoxy resin (II) prepared by epoxidizing the same phenol compound as said phenol compound, a metal hydrate (III) and a molybdenum compound (IV), and a substrate which is impregnated with said resin composition or to which said resin composition is applied.