| 摘要 |
An effective temperature control system comprising a thermoelectric cooling module which can be reversibly attached to a device to be cooled. The power supply for the cooling module is controlled by a feedback controller which is coupled to a thermosensor. The thermosensor for temperature monitoring is also adapted for reversible attachment to the device to be cooled. The cooling module comprises a hot junction and a cold junction. During operation, heat is transferred from the cold junction to the hot junction. An interface panel is provided at the cold junction to insure good contact with the device to be cooled.
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