发明名称 |
Wire bonding apparatus |
摘要 |
A wire bonding method and apparatus using a computer that has a memory which stores correction values that correct positional discrepancies in the height position of a bonding arm and limit values that limit an electric power not only in a state in which no load is applied but also in a state in which a weight is mounted on a supporting frame so that a load equal to a bonding load is applied to a linear motor that raises and lowers the bonding arm. |
申请公布号 |
US6119914(A) |
申请公布日期 |
2000.09.19 |
申请号 |
US19990343568 |
申请日期 |
1999.06.30 |
申请人 |
KABUSHIKI KAISHA SHINKAWA |
发明人 |
TAKAHASHI, KUNIYUKI;HAYASHI, HIJIRI |
分类号 |
H01L21/60;B23K20/00;B23K20/10;(IPC1-7):B23K1/06;B23K5/20;B23K37/00;B23K31/12 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|