发明名称 |
METHOD AND APPARATUS FOR APPLYING SEALING MATERIAL TO PART |
摘要 |
PROBLEM TO BE SOLVED: To evenly apply an adhesive to a sealing face of a part without causing bulging-out. SOLUTION: A mesh screen 4 is put on upper part of a coating stand 1 at a gap and an adhesive 2 film is formed between the mesh screen 4 and the coating stand 1. A cap 3 of an electronic part is prevented from subsiding by being pushed to the mesh screen 4 while the end face 3a of the open part of the cap being set downward and when the cap 3 is lifted up, a film of the adhesive 2 with an even thickness is transferred to the end face 3a of the open part of the cap 3. |
申请公布号 |
JP2000254566(A) |
申请公布日期 |
2000.09.19 |
申请号 |
JP19990059601 |
申请日期 |
1999.03.08 |
申请人 |
MURATA MFG CO LTD |
发明人 |
HIGUCHI MASATO;HIRAKAWA ATSUSHI;MAESAKA MICHINOBU |
分类号 |
B05D1/28;B05C3/20;B05D5/02;H01L21/50;(IPC1-7):B05C3/20 |
主分类号 |
B05D1/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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