发明名称 METHOD AND APPARATUS FOR APPLYING SEALING MATERIAL TO PART
摘要 PROBLEM TO BE SOLVED: To evenly apply an adhesive to a sealing face of a part without causing bulging-out. SOLUTION: A mesh screen 4 is put on upper part of a coating stand 1 at a gap and an adhesive 2 film is formed between the mesh screen 4 and the coating stand 1. A cap 3 of an electronic part is prevented from subsiding by being pushed to the mesh screen 4 while the end face 3a of the open part of the cap being set downward and when the cap 3 is lifted up, a film of the adhesive 2 with an even thickness is transferred to the end face 3a of the open part of the cap 3.
申请公布号 JP2000254566(A) 申请公布日期 2000.09.19
申请号 JP19990059601 申请日期 1999.03.08
申请人 MURATA MFG CO LTD 发明人 HIGUCHI MASATO;HIRAKAWA ATSUSHI;MAESAKA MICHINOBU
分类号 B05D1/28;B05C3/20;B05D5/02;H01L21/50;(IPC1-7):B05C3/20 主分类号 B05D1/28
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