| 摘要 |
A polishing system includes a polishing pad for polishing a surface of a layer provided on a substrate, a surface condition measuring device for detecting a condition of a polishing surface of the polishing pad and a controller for controlling a process to the polishing pad by judging whether the polishing pad can be continuously used for polishing of the surface of the layer provided on the substrate, on the basis of a signal indicative of a measurement from the surface condition measuring device.
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