发明名称 Polyamide resin composition
摘要 A polyamide resin composition comprising 100 parts by weight of a polyamide resin, from 0.01 to 100 parts by weight of a liquid-crystalline resin, and from 0.01 to 5 parts by weight of an acid anhydride all the time has good fluidity even when it is left for a relatively long period of residence time in a cylinder of a molding machine while it is molded, and has good moldability. The amount of cushion resin needed for molding the composition fluctuates little, and the failure such as cobwebbing in molding the composition is reduced. The moldings of the composition have good impact resistance and good outward appearance. The composition is most suitable to producing box-type moldings with thin-wall parts.
申请公布号 US6121388(A) 申请公布日期 2000.09.19
申请号 US19990287045 申请日期 1999.04.06
申请人 TORAY INDUSTRIES, INC. 发明人 UMETSU, HIDEVUKI;SUGIMURA, MASAHIRO;MAKABE, YOSHIKI
分类号 C08K5/092;C08L77/00;C08L77/06;C08L77/12;(IPC1-7):C08L77/00 主分类号 C08K5/092
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