发明名称 Electronics package having electromagnetic interference shielding
摘要 A PCMCIA electronics package adapted to enclose, and provides EMI shielding to, a printed circuit board (PCB). The PCB has an electrical connector adapted for plugging into a computer is at a one end and RF circuitry at the other end. Electronic components are disposed on an inner region of the surfaces of the PCB. The PCB has a ground plane conductor disposed therein. Electrically conductive strips are disposed on the surfaces of the PCB along opposing side edges and the other end of the PCB. A plurality of conductive vias pass through a portion of the PCB electrically connecting the electrical strip conductors to the ground plane conductor. A plurality of resilient, electrically conductive clips is provided. Each one of the clips has: a cup-shaped region disposed over a corresponding one of the PCB edges and the other end of the PCB. Side portions of the cup-shaped regions are in contact with conductive strips. The clips have an arm with a distal end elevated from the PCB. The package includes a pair of electrically conductive covers disposed over the PCB and in contact with the distal ends of the arms. Each clip is elongated and has an array of slots disposed in the distal end of the arm. The arm has a intermediate portion adjacent to the edge of the printed circuit board and the distal end of the arm curves outwardly from the intermediate portion of the arm.
申请公布号 US6122178(A) 申请公布日期 2000.09.19
申请号 US19970978237 申请日期 1997.11.25
申请人 RAYTHEON COMPANY 发明人 ANDREWS, MACDONALD J.;BERARD, RICHARD G.;VANDOREN, ARNOLD E.
分类号 H05K5/02;H05K9/00;(IPC1-7):H05K7/14 主分类号 H05K5/02
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