Structure for printed circuit design

摘要

A substrate structure for surface mount devices includes: a plurality of substrate layers including at least a base layer and an outer layer; the base layer having a contact surface and a first array of conductive pads on the contact surface; the outer layer having a contact surface, a cutout and a second array of conductive pads on the contact surface; and the outer layer being mounted to the base layer with the cutout positioned over the first array, wherein the first array and the second array define in combination a device mounting site.