Process of fabricating semiconductor unit employing bumps to bond two components

摘要

A bump forming step forms a predetermined number of bumps on at least a first one of two components. A height measuring step measures the heights of the predetermined number of bumps. A fixing step fixes the two components together by means of the bumps with the distance between the two components determined, using the result of the height measurement, so that all of the predetermined number of bumps should come in contact with the second one of the two components. An oxide-film removing step removes the oxide film formed on the predetermined number of bumps after the height measuring step and before the fixing step. The fixing step comprises a press fixing step for press fixing the two components at the above distance by means of a press fixing method, and a melting step for causing the bumps to melt in a predetermined atmosphere so that the bumps firmly join the two components together. The distance is established by at least one of the press fixing step and the melting step.