ADHESIVE MATERIAL FILM, SEMICONDUCTOR MOUNTING EXTERNAL CONNECTING MEMBER, SEMICONDUCTOR DEVICE AND THEIR PRODUCTION

摘要

PROBLEM TO BE SOLVED: To provide an adhesive material film difficult to generate voids in the adhesion interface and excessive squeeze-out of the adhesive material in a semiconductor device having a structure to connect semiconductor chips with an external connecting member having a wiring which mounts the semiconductor chips by using the adhesive material film and a semiconductor mounting external connecting member excellent in reliability which uses the adhesive material film, and a semiconductor device. SOLUTION: An adhesive material film which connects semiconductor chips with their mounting external connecting member having a wiring has adhesive layers formed on both sides of a core material having a glass transition temperature of not lower than 200 deg.C such as polyimide, polyethersulfone, poly- amideimide, polyetheretherketone and polyetherimide with a thickness of at least one of the adhesive layers of not smaller than 30μm and a viscosity at the contact bonding temperature of 1×105-1×107 Pa.s.