| 摘要 |
An improved structure of heat dissipating components for memory including two components and two fixing nails. One of the components has a hook portion on the upper end. The upper end and center portion of the outer sides of the two components are arranged with a plurality of holes and a sawtooth shaped radiating surface. Two through holes are installed in proper positions at the lower end of each component. The fixing nails pass through the two through holes at the components, each fixing nail is enclosed by a spring and a flange is installed in the front end of the nail. A recess is installed in the center of the lower end of the nail. According to the aforementioned structure, during assembly, the hook portion of one piece will hook the upper end of another component. Then, two fixing nails are pressed into the through holes of the two components. The flange at the front end of the fixing nail will be buckled in the outer side of the component extruding from the through hole. When detaching, it is only necessary to use a tool to clamp the flange of the fixing nail. By the resilient force of the spring on the fixing nail, the fixing nail will be ejected. Furthermore, the sawtooth shaped radiating surface and the holes on the center portion and the upper end of the two components have a larger heat dissipating area. Thus the heat dissipation efficiency is increased.
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