| 摘要 |
A method of measuring the two-dimensional dopant concentration profile in a source/drain region included in a semiconductor device is disclosed. A semiconductor substrate is etched by an etchant of the kind etching a semiconductor by an amount dependent on a dopant concentration. The etched configuration of the substrate is filled with a filler, and then the filler is separated from the substrate and has its configuration measured. Dopant concentrations and therefore a dopant profile is produced from the configuration of the filler, or a replica of the substrate, measured on the basis of data representative of a relation between the dopant configuration and the amount of etching prepared beforehand. The method insures reliable measurement even in a high dopant concentration region.
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