Semiconductor device having two pluralities of electrode pads, pads of different pluralities having different widths and respective pads of different pluralities having an aligned transverse edge

摘要

In order to solve the aforementioned problems, a semiconductor device according to the present invention comprises a semiconductor chip, a plurality of first electrode pads respectively placed along a peripheral edge portion of the semiconductor chip and having first and second transverse ends, and a plurality of second electrode pads respectively having transverse ends near from center lines of the semiconductor chip, the transverse ends being respectively placed at the same distances from the center lines as the first transverse ends of the first electrode pads along the peripheral edge portion of the semiconductor chip, and having widths broader than those of the first electrode pads. The width of each second electrode pad is formed to 1.5 to 2 times as long as that of each first electrode pad. Wires for electrically connecting the first and second electrode pads and leads are formed so as to be bonded at substantially the same intervals. The heights of the wires are formed so as to be substantially identical to each other.