| 摘要 |
PROBLEM TO BE SOLVED: To improve grinding precision by a method wherein grinding is executed as a sheet-form workpiece is held without deforming the surface of the workpiece. SOLUTION: In this grinding device, by outer carrier 30 and 31 to form static pressure pockets 30c and 31e and inner carrier 60 and 61 to form static pressure pockets 60b and 61b, a silicon wafer 80 fixed at a holder 81 is held in a floating state. The silicon wafer 80, with the holder engaged with external and internal teeth gears 62 and 70, the silicon wafer 80 is rotated and revolved and two surfaces are ground by annular grinding bodies 50b and 51b provided at the end parts of grinding wheels 50 and 51. Since the silicon wafer 80 is held in a state not to deform a surface by each static pressure pocket and ground, grinding precision is improved.
|
