摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a sputtering target and for repairing it so that it can be used and reused in the physical vapor deposition of thin film onto a semiconductor device. SOLUTION: A target base shell (12, 22) is coated by a thermal spraying technique with a source material (14, 24) to be vapor-deposited as thin film. When the source material (14, 24) is eroded during the process of physical vapor deposition, the target (10, 20) can be repaired by applying coating again. This method can be used for both the conventional sputtering target (29) and the newly-developed hollow cathode magnetron sputtering target (10). |