| 摘要 |
PROBLEM TO BE SOLVED: To provide substrates with an adhesive layer stable in adhesive strength which are different in adhesive strength at both sides and have heat resistance, resistance to galvanic corrosion and moisture resistance necessary for mounting semiconductor chips large in the difference in coefficient of thermal expansion on various types of high density printed-wiring boards of glass epoxy substrates, flexible substrates and the like, and adhesive films. SOLUTION: A substrate with an adhesive layer using an acrylic resin is obtained by forming an adhesive layer comprising an acrylic resin composed of (A) 1-10 wt.% structural units derived from a (meth)acrylate monomer having an epoxy group, (B) 10-50 wt.% structural units derived from acrylonitrile, and (C) 40-89 wt.% structural units derived from another copolymerizable monomer and having a weight average molecular weight of 500,000-1,500,000 and a glass transition temperature of -50 to 0 deg.C; an epoxy resin; and an epoxy resin curing agent on a substrate having no same tendency in hydrophobicity or hydrophilicity as the acrylic resin. An adhesive film is obtained by removing the substrate from this substrate with an adhesive resin.
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