发明名称 |
Composite film comprising low-dielectric resin and paraoriented aromatic polyamide |
摘要 |
Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300 DEG C. of within +/-50x10-6/ DEG C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.
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申请公布号 |
US6121171(A) |
申请公布日期 |
2000.09.19 |
申请号 |
US19980056864 |
申请日期 |
1998.04.08 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LTD. |
发明人 |
TAKAHASHI, TSUTOMU;KUMADA, HIROAKI |
分类号 |
C08J5/04;C08J5/18;C08L77/10;H05K1/02;H05K1/03;(IPC1-7):B32B27/34 |
主分类号 |
C08J5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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