| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition suppressed in viscosity rise and plasticity rise even if compounded with a large quantity of the thermoconductive filler, excellent in molding processability and having high thermal conductivity. SOLUTION: This composition comprises (A) 2-69.9 vol.% of an organopolysiloxane of the average compositional formula R1aSiO(4-a)/2 (R1 is a univalent hydrocarbon group; (a) is a positive number of 1.90-2.05), (B) 0.1-50 vol.% of a hydrolyzable group-contg. methylpolysiloxane of formula II (R2 is a 1-4C univalent hydrocarbon group; R3 is a 1-4C alkoxy group or acyloxy group; A is methyl group or a group of ZSiR2bR33-b; Z is an oxygen atom or 2-10C bivalent hydrocarbon group; b is 0, 1 or 2; m is 3-100; n is 0-50; 5<=(m+n)<=100; when n is 0, at least one of As is Z-SiR2bR33-b), (C) 3090 vol.%, and (D) such an amount of a curing agent as to be necessary for curing the composition.
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