发明名称 Printed wiring board and its manufacturing method, and electronic apparatus
摘要 PCT No. PCT/JP95/01941 Sec. 371 Date Mar. 27, 1997 Sec. 102(e) Date Mar. 27, 1997 PCT Filed Sep. 26, 1995 PCT Pub. No. WO96/10326 PCT Pub. Date Apr. 4, 1996A cutout portion 12 is formed by partially cutting out a board along a predetermined fold and a first portion 14 and a second portion 15 partitioned along the fold are folded and attached together into a unitary body by a bonding agent or thermal fusing. Formed on a surface of the printed wiring board 11 is a conductor pattern 17 that continuously runs across the fold at the cutout portion between the first portion and the second portion, and thus the conductor pattern assuring continuity between both sides of a printed wiring board 20 results without the need for providing through-holes. By employing such a printed wiring board, a compact and low-cost feature can be implemented into electronic apparatuses or portable information apparatuses, such as liquid crystal display devices or electronic printers, through a miniature, light-weight and flat design effort.
申请公布号 US6121988(A) 申请公布日期 2000.09.19
申请号 US19970809801 申请日期 1997.03.27
申请人 SEIKO EPSON CORPORATION 发明人 UCHIYAMA, KENJI
分类号 G02F1/13;H01L23/498;H01L23/538;H05K1/00;H05K1/11;H05K3/00;H05K3/28;H05K3/32;H05K3/36;H05K3/40;(IPC1-7):H05K1/02 主分类号 G02F1/13
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