Automated detection of a significantly bent lead of a plurality of leads on an integrated circuit package

摘要

An apparatus and method for automatically detecting when a lead of an integrated circuit package is bent more than a predetermined bend distance. The integrated circuit package has a plurality of leads aligned in a row with a predetermined separation distance between each two adjacent leads. A comb structure having a plurality of teeth is lowered toward the row of the plurality of leads on the integrated circuit package. A tooth of the comb structure fits between respective two adjacent leads of the row of plurality of leads on the integrated circuit package when each of the respective two adjacent leads is bent toward each other with less than the predetermined bend distance as the comb structure is lowered toward the row of plurality of leads on the integrated circuit package. On the other hand, the tooth of the comb structure does not fit between the respective two adjacent leads when any of the respective two adjacent leads is bent toward each other with more than the predetermined bend distance as the comb structure is lowered toward the row of plurality of leads on the integrated circuit package. A monitor detects when any tooth of the comb structure does not fit between the respective two adjacent leads as the comb structure is lowered toward the row of plurality of leads on the integrated circuit package, and in that case, a warning indicator provides a warning signal.