发明名称 |
Buried patterned conductor planes for semiconductor-on-insulator integrated circuit |
摘要 |
A semiconductor-on-insulator integrated circuit with buried patterned layers as electrical conductors for discrete device functions, thermal conductors, and/or decoupling capacitors.
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申请公布号 |
US6121659(A) |
申请公布日期 |
2000.09.19 |
申请号 |
US19980049488 |
申请日期 |
1998.03.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CHRISTENSEN, TODD ALAN;SHEETS, II, JOHN EDWARD |
分类号 |
H01L21/84;H01L23/52;H01L27/08;H01L27/12;H01L29/40;H01L29/786;(IPC1-7):H01L21/01;H01L29/06 |
主分类号 |
H01L21/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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