发明名称 HOT-MELT INK COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a hot-melt composition having high adhesivity to a material to which the composition is transferred, not causing the release of print, having excellent crack resistance of ink in the case of fixation by pressure, providing excellent printing qualities. SOLUTION: This hot-melt composition comprises a wax having >=10, preferably 10-100 penetration at ordinary temperature. For example Hi-Mic-1,045 (35 penetration) made of Nippon Seiro Co., Ltd., Hi-Mic-2,045 (21 penetration), Hi-Mic-2,065 (12 penetration) (microcrystalline wax), A-C 1,702 (98 penetration) (polyethylene wax) made of Allied Signal Co., Mitsui high wax 110P (25 penetration) (polyethylene wax) made of Mitsui Chemicals Inc., soft paraffin No.3 (80 penetration) (paraffin wax) made of Nippon Oil Co. Ltd., etc., may be cited as the wax.
申请公布号 JP2000256595(A) 申请公布日期 2000.09.19
申请号 JP19990062983 申请日期 1999.03.10
申请人 BROTHER IND LTD 发明人 MAEDA SANENOBU
分类号 B41J2/01;B41M5/00;C09D11/00;C09D11/34 主分类号 B41J2/01
代理机构 代理人
主权项
地址