发明名称 PHOTOSENSITIVE RESIN AND COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a photosensitive resin which gives a composition having a good developability, a high heat resistance, and excellent heat resistance and electrical insulation reliability after moisture absorption by reacting a polybasic acid anhydride with a reaction product of an epoxy acrylate with a cyanic ester compound. SOLUTION: The epoxy acrylate is a reaction product of an epoxy resin with acrylic acid, and an epoxy acrylate of bisphenol A type is suitable, The cyanic ester compound is a compound having one or more, usually 5 or lower, cyanate groups and preferably is an aromatic organic compound having 2-5 cyanate groups directly bonded to an aromatic ring, Usually, 5-40 pts.wt. cyanic ester compound and 10-90 pts.wt. polybasic acid are used based on 100 pts.wt. epoxy acrylate, The photosensitive resin is compounded with an epoxy resin to give the photosensitive resin composition.
申请公布号 JP2000256437(A) 申请公布日期 2000.09.19
申请号 JP19990061075 申请日期 1999.03.09
申请人 MITSUBISHI GAS CHEM CO INC 发明人 ISHII KENJI;HAGIWARA ISAO;HARADA TORU;YOKOYAMA JUN
分类号 G03F7/027;C08G59/14;C08G59/17;C08G59/40;C08G59/42;C08G73/06;G03F7/038;H05K3/28 主分类号 G03F7/027
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