| 摘要 |
A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to fill the engraved markings and provide a surface suitable for re-marking. The covering material may be applied in a flowable state by applicator contact or by non-contact dispensing, or may be applied as a preformed segment. The exterior surface to be covered may be pre-treated to enhance bonding of the covering material. The covering material may be bonded to the marked surface in a post-application curing operation. De-marked integrated circuit packages are also disclosed. |
