发明名称 LOW THERMAL EXPANSION ALLOY SHEET AND ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide a low thermal expansion Fe-Ni or Fe-Ni-Co alloy sheet excellent in adhesion of resist and also to provide electronic parts using the sheet. SOLUTION: The sheet is a low thermal expansion Fe-Ni alloy sheet containing 30-50 wt.% Ni or a low thermal expansion Fe-Ni-Co alloy sheet containing 26-38 wt.% Ni and 1-20 wt.% Co. A surface layer containing hydroxide together with oxide is formed. With respect to the surface layer, the ratio of oxygen in the state of hydroxide to oxygen in the state of oxide is regulated to >=0.4; or, with respect to the surface layer, the ratio of Ni in the state of oxide and hydroxide to Fe in the state of oxide and hydroxide is regulated to >=0.5.
申请公布号 JP2000256800(A) 申请公布日期 2000.09.19
申请号 JP19990058368 申请日期 1999.03.05
申请人 NKK CORP 发明人 SATO KAORU;ARIGA TAMAKO;MORITA YASUHIRO;YAMAMOTO AKIRA
分类号 C22C38/00;C22C38/08;C22C38/10;(IPC1-7):C22C38/00 主分类号 C22C38/00
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