An IDC connector comprises a dielectric housing having mating and connecting faces and an array of passageways defined therebetween. A pair of retaining wedges is formed on opposite ends of the housing. An array of ground and signal terminals is alternately assembled within the array of passageways and each terminal includes an insulation displacement section extending beyond the mating face and a connecting portion received within the passageway. A flat cable having a plurality of ground and signal wires is electrically terminated to the insulation displacement sections of the terminals, respectively. A cover is assembled to the mating face of the housing for attaching the flat cable to the insulation displacement sections extending from the mating face. The cover forms a pair of latches on opposite ends thereof for engagement with the wedges. A grounding device having at least a pair insulation displacement sections electrically connects two conductive wires terminated to the ground terminals.
