SHIP STACK PACKAGE

摘要

PURPOSE: A chip stack package is to accomplish excellent electrical properties by shortening the length of electrical connection and to facilitate dissipation of heat generated in an integrated circuit chip to exterior. CONSTITUTION: An integrated circuit chip(102, 104) comprises an active region formed of a circuit pattern. The chip also has a recess at its both sides to be electrically conducted with the circuit pattern. A lead(108) is inserted into the recess of the integrated circuit chip to connect the chips electrically to each other and to exterior. A molding compound(116) encapsulates the active region of the integrated circuit chip and the lead. A heat spreader(114) is attached to at least one surface of the outer surfaces of a stacked structure of the integrated circuit chips. At least one surface of the outer surfaces is exposed. The lead consists of a vertical lead(108a) which is inserted into a recess of the integrated circuit chip to electrically connect the chips and a horizontal lead(108b) which is attached to the vertical lead to be connected to exterior. The first unit package and the second unit package are connected to each other by a solder ball which connects protruded ends of the vertical leads of the unit packages.