发明名称 |
APPARATUS FOR FIXING WAFER |
摘要 |
PURPOSE: An apparatus for fixing a wafer is provided to rapidly fix and separate the wafer, and to prevent a foreign substance from being induced in fixing the wafer, by fixing the wafer by a clamp when the wafer is mounted on the inside of a process chamber. CONSTITUTION: In an apparatus for fixing a wafer(3) on an upper surface of a jig plate(1) mounted on a robot arm in a process chamber, a plurality of fixing elements and clamps are established in the jig plate. The fixing element adheres/separates the wafer to/from an adhesion pad(2), in which the wafer is mounted on the jig plate by intervening the adhesion pad. In the clamp, a rotating plate(8) connected to a side of a operating handle(10) is built in a supporting plate(5) to rotate the fixing element.
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申请公布号 |
KR20000056439(A) |
申请公布日期 |
2000.09.15 |
申请号 |
KR19990005771 |
申请日期 |
1999.02.22 |
申请人 |
SAMSUNG ELECTRO MECHANICS CO., LTD. |
发明人 |
LEE, CHANG HUI;KIM, GWANG SU;PARK, GI WON |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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