| 摘要 |
PURPOSE: A probe card is provided to realize high-speed semiconductor integrated circuits without reducing S/N ratio of signals and generating signal attenuation and crosstalk between interconnection lines. CONSTITUTION: A probe card includes a probe(100) coming into contact with an electrode(710) of a semiconductor integrated circuit(700) to be tested, and a substrate(200) on which interconnection patterns are formed. The probe also has a connecting means(300) for connecting the substrate and the probe to each other, and a shielding means(400), placed on the back of the substrate, for shielding the connecting means. The shielding means has four insulating plates(410A,410B,410C,410D), and each of conductive layers is formed on one side of each of the insulating plates. The insulting plates have through-holes, respectively.
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