| 摘要 |
PURPOSE: A press for forming semiconductor package lead frame is provided to remove vibration by distributing important drive parts in a lower part of the press and to reduce noise even in high speed work status by integrally fixing a ram to a movable die and causing the ram to be moved up/down by four guide posts. CONSTITUTION: A fixed die(10) is fixed on a support block(11) to which a lower mold(12) is fixed. Four guide posts(20) pass through four points of the fixed die(10). A movable die(30) is coupled integral with top ends of the guide posts(20), and a ram(40) connected to an upper mold(31) is mounted on the center of the die(30). A crank shaft(60) is mounted on the support block(11) to be rotated by a servo motor(50) and has an eccentric cam(61). A joint(70) connects the lower ends of the guide posts(20) to the eccentric cam(61) of the crank shaft(60) so that the rotation of the crank shaft(60) can be changed into the vertical reciprocal motion of the guide posts.
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