| 摘要 |
PURPOSE: A roller for removing a dry film vinyl of a printed circuit board is provided to reduce defective proportion by employing an improved roller capable of removing a vinyl with ease and to improve work efficiency by reducing a time consumed to replace the roller. CONSTITUTION: A dry film photosensitive paper is coated on a surface of a printed circuit board during a laminating process. A dry film protecting vinyl is rolled on a roller(1) for removing the vinyl. A groove(2) having a predetermined depth is formed on the vinyl removing roller in a length direction. The groove is longer than the length at which the vinyl is wound. A tip of a knife(4) is inserted into a left side of the groove(2) on which a vinyl is not wound and is moved in K direction in order to remove the vinyl(3) which is wound on the roller(1) after performing the laminating process for a predetermined period of time. A user uses a cut portion(C) where the vinyl(3) is cut and removes the vinyl(3) from the roller(1).
|
