BALL GRID ARRAY PACKAGE

摘要

PURPOSE: A ball grid array package is provided to reduce the number of defects of a package by making a dented solder ball, so that the solder ball is precisely adhered to a lower part of a bump. CONSTITUTION: A ball grid array package(100) having a semiconductor chip(111), a lead frame(114), a moulding resin(118) and a solder ball(117), comprises a receiving groove(116a) of a predetermined shape for solidly soldering the solder ball on an exposed surface of a bump(116). The lead frame has a lead part electrically wire-bonded to the semiconductor chip. The solder ball is soldered to the bump which is exposed to the outside of the moulding resin from the lead part for an electrical connection between the lead part of the lead frame and an external circuit.