SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor device and a manufacturing method thereof are provided to be capable of preventing moisture from penetrating into the semiconductor device. CONSTITUTION: A semiconductor package is provided with a conductive lead frame(2), and a resin body having a cavity for loading a semiconductor chip(7). A flat adhesive surface is formed at the bottom of the cavity for stably fixing the semiconductor chip. The bottom of the cavity is made of a resin layer. The semiconductor package further includes a dampproof plate. At this time, the dampproof plate includes an island region(3) spaced apart from the adhesive surface as much as 100 μm, or more. Preferably, the size of the island region is the same as or larger than that of the adhesive surface.