| 摘要 |
<p>PURPOSE: A semiconductor CL package is provided to prevent a contact badness and to be easy for assembly. CONSTITUTION: The semiconductor CL package comprises: a substrate(11) having a through hole(11a) formed in a center of the substrate and contact holes(11c) disposed at each corner of the substrate, wherein a stair-shaped portion(11b) is formed at the top of the through hole(11a) and in an inner side thereof; a semiconductor chip(13) disposed at the stair-shaped portion of the substrate(11); a plurality of chip pads(13a) formed on the upper side of the chip; a plurality of metal wires(14) electrically connected to one ends of circuit lines(12) which are laid in the substrate(11); terminal columns(15) each having a circular form, each of the terminal columns inserted in a corresponding contact hole formed in the substrate(11); a plurality of leads(17) installed so as to be exposed from the outer side of the respective terminal columns(15), wherein the leads(17) are contacted to the other ends of the circuit lines, respectively; a molding substance(16) for surrounding the chip, the metal wires, and a part of the respective terminal columns, the molding substance molded at the top of the substrate; and a heat sink(18) for heat emission installed in the through hole of the substrate.</p> |
