| 摘要 |
The process brings together two layers (30,42) of thermally fusible plastic, between which an electronic unit (32) is inserted with connections (e.g. 34) to a conductive winding (14). The integrated circuit (4) is enclosed in a module (38) containing all other components of the electronic unit, and is linked to the connections by wires (10). The module is symmetrical about its median plane (40) so that the pressure exerted on it by the two layers during hot-pressing is uniform over its upper and lower faces (50,52). The layers are softened sufficiently for bonding together without loss of planarity of their outer surfaces (46,48).
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