STACKABLE BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND A METHOD THEREOF

摘要

PURPOSE: A BGA(ball grid array) package and its manufacturing method are to increase functional capacity of a semiconductor package within limited area by manufacturing the BGA package module of multiple layers without additional processes. CONSTITUTION: A cavity(21) is formed at a center of a substrate body(20). An interconnect pattern layer(40) comprises the first, the second and the third interconnect pattern parts, each being attached to bottom, side and top of the substrate body. A solder ball(90) is attached to the first outer terminal pad(44a) formed on the first interconnect pattern part(41). The second terminal pad(44b) is formed on the third interconnect pattern(43) to be correspond to the first outer terminal pad. An inner terminal pad(45) is formed at an end of the third interconnect pattern part to be connected to one end of a wire(70). A semiconductor chip(60) is attached to bottom of the cavity. Many conductive wires electrically connect the semiconductor chip to the interconnect. The cavity is filled with a molding part(80) to seal the space between the semiconductor chip and the wire.