| 摘要 |
PURPOSE: A laser diode package is provided to stabilize the operation by allowing the chip to produce heat emission stably, to miniaturize the chip size, and to increase the durability. CONSTITUTION: In the laser diode, a header has a sidewall(110a) surrounded the header. Multiple leads(130) are formed on the bottom surface of the header to be connected to external devices electrically. On one side of the sidewall(110a), a through hole(111) is formed. A thermoelectric cooler(TEC)(120) is fixed inside the through hole(111) looking to a hot flate(121). An L-type base(100) is fixed on the center of the bottom of the header(110) through an insulation element(120). A vertical extender(101) is fixed on the cold flate(120) of the thermoelectric cooler(TEC). Here, as the hot flate(121) is exposed, heat release is good. And as the cold flate(120) is fixed on the wall(110a) of the header , the structure can be miniaturised.
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