METHOD OF REWORKING WAFER FOR SEMICONDUCTOR DEVICE AND OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for reworking a semiconductor device manufacturing wafer is to completely remove and rework a photoresist coated abnormally by using an innoxious thinner composition having the proper melting speed and the volatility. CONSTITUTION: A photoresist(23) is coated on a semiconductor substrate(21) to form a specific pattern on the semiconductor substrate. The semiconductor substrate with the photoresist formed thereon is loaded on a rotatable vacuum chuck. A thinner composition is supplied to the loaded semiconductor substrate. The thinner composition is produced by mixing 70 wt % to 80 wt % of ethyl-3-ethoxy propionate, 17 wt % to 23 wt % of ethyl lactate, and 4 wt % to 7 wt % of gamma-butyro lactone. The photoresist is soaked in the thinner composition for a predetermined time until it melted by the thinner composition. After rotating the vacuum chuck, the photoresist is removed by using the thinner composition.