发明名称 |
BALL GRID ARRAY PACKAGE AND FABRICATING METHOD THEREOF |
摘要 |
<p>A chip size package is disclosed herein, as well as a method for fabricating the same. A recess is formed in a surface of semiconductor chip. Bonding pads are formed on a bottom center of the recess and insulating pads 30 are formed on both lateral sides of the recess. The respective pads are connected to each other with metal wires. An epoxy compound is filled in the recess. Herein, midway portions of the metal wires are exposed from the epoxy compound. Bumps are formed on the midway portions of the metal wires being exposed from the epoxy compound and solder balls are mounted on the bumps. Therefore, the epoxy compound is not protruded from the semiconductor chip, thickness of the package is equal to that of the semiconductor chip. The thickness of package is minimized.</p> |
申请公布号 |
KR100265563(B1) |
申请公布日期 |
2000.09.15 |
申请号 |
KR19980025015 |
申请日期 |
1998.06.29 |
申请人 |
HYUNDAI ELECTRONICS IND. CO., LTD |
发明人 |
PARK, SANG WOOK;KIM, JI YON |
分类号 |
H01L23/12;H01L21/60;H01L23/24;H01L23/48;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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