| 摘要 |
PROBLEM TO BE SOLVED: To effectively expose only and end of a bump electrode laminating an adhesive obtained by evaporating a solvent component and filmizing it on a circuit board, and then curing the adhesive. SOLUTION: First, a PET film previously mode released as a base film 9 is used, and the mold released surface of the film is coated with a liquid-like thermoplastic polyimide adhesive as a liquid-like adhesive 6. Then, the PET film coated with the adhesive 6 is heated to evaporate a solvent component. Then, an adhesive film having a thickness of about 20 μm is formed on the PET film. Then, the filmized adhesive is laminated on a side provided with a bump electrode 2 of the circuit board. Eventually, the PET film is released from the adhesive, cured, and an adhesive layer 4 is formed on the board 1. The end of the electrode 2 is exposed by bringing an etchant into contact with a surface of the layer 4 and reducing a thickness of the adhesive. |
