发明名称 RESIN MOLDING MOLD AND METHOD OF FORMING HARD COAT ON RESIN MOLDING MOLD
摘要 <p>A diamond-like carbon film (30) is formed on that part, at least in contact with a stamper (6), of the surface (2a) of a movable mold (2) to which the stamper (6) is attached and which, together with a fixed mold (1), forms a cavity (5) of a resin molding mold, via an intermediate layer (20) consisting of silicon, tungsten, titanium carbide, silicon carbide, chromium carbide and the like for increasing an adhesion power with respect to the surface (2a) of the mold (2), thereby dramatically prolonging a service life of a resin molding mold and a lifetime of a stamper without damaging it.</p>
申请公布号 WO2000053386(P1) 申请公布日期 2000.09.14
申请号 JP2000001342 申请日期 2000.03.06
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